2Gb: x16, x32 Mobile LPDDR2 SDRAM S4
Refresh Requirements
t DQSS,(max,derated)
= 1.25 - ( t JIT(per),act,max - t JIT(per),allowed,max)/ t CK(avg) =
1.25 - (193 - 100)/2500 = 1.2128 t CK(avg).
Refresh Requirements
Table 85: Refresh Requirement Parameters (Per Density)
Parameter
Symbol
64Mb
128Mb 256Mb 512Mb
1Gb
2Gb
4Gb
8Gb
Unit
Number of banks
4
4
4
4
8
8
8
8
Refresh window: T CASE ≤ 85?
Refresh window:
t REFW
t REFW
32
8
32
8
32
8
32
8
32
8
32
8
32
8
32
8
ms
ms
85?C < T CASE ≤ 105?C
Required number of REFRESH
R
2048
2048
4096
4096
4096
8192
8192
8192
commands (MIN)
Average time be-
REFab
t REFI
15.6
15.6
7.8
7.8
7.8
3.9
3.9
3.9
μ s
tween REFRESH com- REFpb
mands (for reference
t REFIpb
(REFpb not supported below 1Gb)
0.975
0.4875
0.4875
0.4875
μ s
only) T CASE ≤ 85?C
Refresh cycle time
t RFCab
90
90
90
90
130
130
130
210
ns
Per-bank REFRESH cycle time
t RFCpb
na
60
60
60
90
ns
Burst REFRESH window =
t REFBW
2.88
2.88
2.88
2.88
4.16
4.16
4.16
6.72
μ s
4 × 8 × t RFCab
PDF: 09005aef83f3f2eb
2gb_mobile_lpddr2_s4_g69a.pdf – Rev. N 3/12 EN
141
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2010 Micron Technology, Inc. All rights reserved.
相关PDF资料
MT45W1MW16BDGB-708 AT IC PSRAM 16MBIT 104MHZ 54VFBGA
MT48H32M16LFB4-75B IT:C IC SDRAM 512MB 54VFBGA
MT48H8M16LFB4-75 IT:K TR IC SDRAM 128MBIT 133MHZ 54VFBGA
MTC100-JA2-P34 CONTACT INSERT PIN
MX841BE IC CONVERTER WHITE LED 8-SOIC
MXHV9910BTR IC LED DRIVER HIGH BRIGHT 8-SOIC
MXN12FB12F MOTOR BRUSHED DC 12V 2922RPM
MXN13FB08B1 MOTOR BRUSHED DC 8V 4714RPM
相关代理商/技术参数
MT42L256M32D4KP-MS 制造商:Micron Technology Inc 功能描述:256MX32 LPDDR2 PLASTIC IND TEMP GREEN WFBGA 1.2V - Bulk